The fundamentals of designing deployable structures with elastic memory composites

IEEE Aerospace Conference Proceedings

Volumn 4, Issue , 2004, Pages 2745-2756

  Lake, Mark S ^a   Campbell, Douglas ^a  

^a Compos Technology Development Inc ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPRESSIVE STRAIN; DEPLOYMENT ENERGY; ELASTIC MEMORY COMPOSITES (EMC); SHAPE MEMORY RESINS;

ELASTIC MODULI; ELECTROMAGNETIC COMPATIBILITY; ELECTRONICS PACKAGING; HEATING; SPACECRAFT; STRAIN; THERMOSETS;

COMPOSITE MATERIALS;

EID: 11244321706     PISSN: 1095323X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/AERO.2004.1368072     Document Type: Conference Paper

References (14)

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