Creep behavior of unidirectional and angle-ply T800H/3631 laminates at high temperature and simulations using a phenomenological viscoplasticity model

Composites Science and Technology

Volumn 64, Issue 15 SPEC. ISS., 2004, Pages 2373-2384

  Kawai, M ^a   Masuko, Y ^a  

^a UNIVERSITY OF TSUKUBA   (Japan)

Author keywords

A. Polymer matrix composites; B. Creep; B. High temperature properties; C. Laminates; Carbon epoxy; Viscoplasticity

Indexed keywords

CARBON; CREEP; DEFORMATION; EPOXY RESINS; FIBER REINFORCED MATERIALS; HIGH TEMPERATURE EFFECTS; MATHEMATICAL MODELS; STRESS ANALYSIS; TENSILE TESTING; VISCOPLASTICITY;

ANGLE-PLY LAMINATES; CREEP STRESSES; ELASTOVISCOPLASTIC BEHAVIOR; FIBER ROTATION;

LAMINATED COMPOSITES;

CARBON FIBER; COMPOSITE PROPERTY; CREEP; HIGH TEMPERATURE APPLICATION; LAMINATE;

EID: 11144348094     PISSN: 02663538     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.compscitech.2004.04.004     Document Type: Article

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