Preferred orientation of electrolytic copper foil

Beijing Hangkong Hangtian Daxue Xuebao/Journal of Beijing University of Aeronautics and Astronautics

Volumn 30, Issue 10, 2004, Pages 1008-1012

  Zhang, Shichao ^a   Jiang, Tao ^a   Bai, Zhiming ^a  

^a BEIHANG UNIVERSITY   (China)

Author keywords

Copper foil; Electro deposition; Texture

Indexed keywords

COPPER; CRYSTAL ORIENTATION; CURRENT DENSITY; ELECTRODEPOSITION; ELECTROLYTES; GLUES; SOLUTIONS; TENSILE STRENGTH; TEXTURES;

COPPER FOIL; ELECTROLYTE SOLUTION; INTERCRYSTALLINE DISTRIBUTION; PREFERRED ORIENTATION;

METAL FOIL;

EID: 11144233027     PISSN: 10015965     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (13)

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