Application of a Doehlert experimental design to the optimization of an Au-Co plating electrolyte

Journal of Applied Electrochemistry

Volumn 34, Issue 11, 2004, Pages 1177-1184

  Chalumeau, L ^a   Wery, M ^a   Ayedi, H F ^b   Chabouni, M M ^c   Leclere, C ^d  

^a UNIVERSITÉ DE FRANCHE COMTÉ   (France)

^b URCI   (Tunisia)

^c Ecl Natl d'Ing de Sfax BP   (Tunisia)

^d DAT R and D   (France)

Author keywords

Canonical analysis; Doehlert experimental design; GDOES; Gold electrodeposit; XPS

Indexed keywords

COMPOSITION; DEPOSITION; GOLD ALLOYS; OPTIMIZATION; SPECTROSCOPY; STATISTICAL METHODS;

BUFFER SOLUTION; CONTACT RESISTANCE; HARD GOLD; HARDENING METALS;

ELECTROLYTES;

EID: 10844273988     PISSN: 0021891X     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10800-004-1703-3     Document Type: Article

References (50)

1. F.H. Reid and W. Goldie (eds.), Gold Plating Technology (Electrochemical Publications, Ayr 1974).
2. M. Antler, Plating 60 (1973) 468.
3. Y. Okinaka and M. Hoshino, Gold Bull. 31 (1998) 3.
4. V.A. Zabludovskii, A.V. Krapivnoi, V.I. Kaptanovskii and N.A. Kostin, Elektrokhimiya 25 (1989) 1258.
5. S.J. Hemsley and R.V. Green, Trans. Int. Metal Finish. 69 (1991) 149.
6. R.M. Krishnan, S. Srivceraraghavan and S.R. Natarajan, Metal Finish. 86 (1988) 56.
7. H.U. Galgoon, Feingerätetechnik 38 (1989) 353.
8. H. L. Cohen, K.W. West and M. Antler, J. Electrochem. Soc. 124 (1977) 342.
9. K. Lin, R. Weil and K. Desai, J. Electrochem. Soc. 133 (1986) 690.
10. J.A. Lochet, Proc. AESF. Annu. Techn. Conf. 77th Vol. 2. (1990) p.983.
11. S.T. Rao and R. Weil, Trans. Int. Metal Finish. 57 (1979) 97.
12. L. Sjögren, B. Asthner, L.G. Liljestrand and L.B. Revay, Plat. Surf. Finish. 73 (1986) 70.
13. Y.G. Li, W. Chrzanowski and A. Lasia, J. Appl. Electrochem. 26 (1996) 385.
14. Y.G. Li and A. Lasia, J. Appl. Electrochem. 26 (1996) 853.
15. Y.G. Li and A. Lasia, J. Appl. Electrochem. 27 (1997) 643.
16. A. Blair and D. Becker, AES Sur/fin'82, Anna. Techn. Conf. 70th (1983).
17. R.L. Cohen, F.B. Koch, L.N. Schoenberg and K.W. West, J. Electrochem. Soc. 126 (1979) 1608.
18. J.H. Thomas III, S.P. Sharma, J. Electrochem. Soc. 126 (1979) 445.
19. H. Leidheiser Jr., A. Vertes, M.L. Varsanyi and I. Czako-Nagy, J. Electrochem. Soc. 126 (1979) 391.
20. R. De Donker and J. Vanhumbeek, Trans. Int. Metal. Finish. 62 (1985) 59.
21. P. Bindra, D. Light, P. Freudenthal and D. Smith, J. Electrochem. Soc. 136 (1989) 3616.
22. N.N. Balashova, T.A. Smirnova, N.A. Smagunova and A.K. Yudina, Zh. Prikl. Khim. 50 (1977) 2698.
23. H.R. Khan, M. Baugärtner and Ch. J. Raub, In Proceedings of the Symposium on Electrodeposition Technology: Theory and Practice (Electrochemical Society, Pennington, NY, 1987) p. 165.
24. I.E. Dinan and H.Y. Cheh, J. Electrochem. Soc. 139 (1992) 410.
25. H.A. Reinheimer, J. Electrochem. Soc. 121 (1974) 490.
26. F.B. Koch, Y. Okinaka, C. Wolowodiuk and D.R. Blessington, Plat. Surf. Finishing 67 (1980) 50.
27. F.B. Koch, Y. Okinaka, C. Wolowodiuk and D.R. Blessington, Plat. Surf. Finishing 67 (1980) 43.
28. Y. Okinaka and S. Nakahara, J. Electrochem. Soc. 123 (1976) 1284.
29. Ch.J. Raub, A. Knödler and J. Lendvay, Plat. Surf. Finish. 63 (1976) 35
30. H. Angerer and N. Ibl, J. Applied Electrochem. 9 (1979) 219.
31. A. Knödler, Metalloberfläche Angwandte Elecktrochemie 28 (1974) 465.
32. Y. Okinaka, F.B. Koch, C. Wolowodiuk and D.R. Blessington, J. Electrochem. Soc. 125 (1978) 1745.
33. R.V. Green and T. Jones, Trans. Int. Metal Finish. 75 (1997) 162.
34. T.A. Davies and P. Watson, Plating 60 (1973) 1138
35. D.L. Malm and M.J. Vasile, J. Electrochem. Soc. 120 (1973) 1484.
36. D. H. Dochlert, Appl. Statist. 19 (1970) 231.
37. D. Mathicu, J. Nony and R. Phan Tann-Luu, 'NEMPOD-W software' (LPRAI, Marseiile, 2002).
38. D. Mathieu and R. Phan Tann-Luu, In Plans d'Expériences: Application à l'entreprise (Technip, Paris, 1995).
39. D. C. Montgomery, In Design and Analysis of Experiments (Wiley, New York, 1991).
40. J. Goupy, In Plans d'Expériences Pour Surfaces de Réponse (Dunod, Paris, 1999).
41. A.I. Khuri and J.A. Cornell, In Response Surfaces: Design and Analyses (M. Dckker, New York, 1996).
42. H.J. Leary, Jr., D.S. Campbell, J.S. Slattery and R.J. Sargent, In ESCA Surface Analysis of Plasma Exposed Silicon Nitride and Photorsist Polymer Films (IBM General Technology Division editor, Essex).
43. R. Erre, R. Benoit, F. Beguin and M. Inagaki, International Symposium on Carbon 2 (1990) 6PA 16, 806.
44. P. Sundberg, R. Larsson and B. Folkesson, Electron Spectrosc. Rel. Phenom. 46 (1988) 19.
45. V.B. Wiertz and P. Bertrand, In Identification of the n-containing Functionalities Introduced at the Surface of Ammonia Plasma Treated Carbon Fibres by Combined TOF SIMS and XPS, Unité de Physico-Chimie et de Physique des Matériaux, Univ. Louvain 1348 Editor, Louvain.
46. N.M.D. Brown, J.A. Hewitt and B.J. Mcenan, Surf. Interface. Analy. 18 (1992) 187.
47. Q.T. Le, M. Chtaib, J.J. Pireaux and R. Caudano, Le Vide, les Couches Minces, Supplément 258 (1991) 86.
48. C.D. Wagner, W.M. Riggs, L.E. Davis and J.F. Moulder, In Handbook of XPS (Perking-Elmer Corp., Physical Electronics Division Editor).
49. C. Jones and E. Samman, Carbon 28 (1990) 509.
50. K. Merritt, R.S. Wortman, M. Millard and S.A. Brown, Biomat., Med. Dev., Art. Org. 11 (1983) 115.