Design and fabrication of a direction sensitive MEMS shear stress sensor with high spatial and temporal resolution

Journal of Micromechanics and Microengineering

Volumn 14, Issue 12, 2004, Pages 1718-1725

  Desai, A V ^a   Haque, M A ^a  

^a The Center for Nanotechnology Education and Utilization   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BANDWIDTH; FABRICATION; FLUID DYNAMICS; REYNOLDS NUMBER; SENSORS; SHEAR STRESS; SILICON WAFERS;

FLOW SEPARATION; SILICON-ON WAFER (SOI) TECHNOLOGY; TEMPORAL RESOLUTIONS; TURBULENCE TRANSITION;

MICROELECTROMECHANICAL DEVICES;

EID: 10844260063     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/14/12/017     Document Type: Article

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