Development of super high-density optical circuits using downsized fibers, flame-retardant tape fiber, and multi-fiber optical connectors

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 824-829

  Ohtsuka, Kenichiro ^a   Tanaka, Kousuke ^a   Ishikawa, Shinji ^a   Hosoya, Toshifumi ^a  

^a SUMITOMO ELECTRIC INDUSTRIES LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC WIRING; INJECTION MOLDING; LIGHT TRANSMISSION; LINEAR EQUATIONS; MICROPROCESSOR CHIPS; OPTICAL INTERCONNECTS; PRINTED CIRCUIT BOARDS;

FIBER SPLICING; OPTICAL CIRCUITS; OPTICAL CONNECTORS;

OPTICAL FIBERS;

EID: 10444278034     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. E. Suhir, "Bending Stress in an Optical Fiber Interconnect Experiencing Significant Ends Off-Set," Proceedings of the Materials Research Society, 531, 215-222 (1998).
2. G. S. Glaeseman, "The Mechanical Reliability of Corning Optical Fiber in Bending," Corning White Paper WP3690 (2002).
3. Y. Mitsunaga, "Failure Prediction for Long-Length Optical Fiber Based on Proof Testing," J.Appl.Phys. 53[7], 4847-4853 (1982).
4. W. Sakurai, "Development of Chamfer-Type Super Low Loss MPO Connector Using PPS Ferrule," Proceedings of the 51st International Wire and Cable Symposium, now in print (2002).