An accurate electromagnetic modeling of the die-to-die interconnect link for Gigabit systems applications

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2004, Pages 1891-1894

  Prokofiev, Victor ^a   Shrivastava, Udy A ^a   Hill, Michael ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC LINES; ELECTRIC NETWORK ANALYZERS; ELECTRIC POWER SYSTEM INTERCONNECTION; ELECTROMAGNETIC FIELDS; ELECTROMAGNETISM; ELECTRONICS PACKAGING; FREQUENCY DOMAIN ANALYSIS; JITTER; MICROSTRIP LINES; PERMITTIVITY;

ELECTROMAGNETIC MODELING; GIGABIT SYSTEMS; MICROPROBES; VECTOR NETWORK ANALYZER (VNA);

ELECTRIC CONNECTORS;

EID: 10444277274     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. th Electronic Components and Technology Conf, 2003
2. Stephen A. Mass "The RF Microwave and Circuit Design Cookbook"
3. Karen M. Coperich Branch, Member, IEEE, Jason Morsey, Andreas C. Cangellaris, Fellow, IEEE, andAlbert E. Ruehli, Fellow, IEEE "Physically Consistent Transmission Line Models for High-Speed Interconnects in Lossy Dielectrics" IEEE TRANSACTIONS ON ADVANCED PACKAGING, VOL. 25, NO. 2, MAY 2002 129