A high throughput optoelectronic module assembly process

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2004, Pages 1475-1478

  Schwab, Paul ^a   Bowen, Terry ^a   Perko, Richard ^a   Delen, Nuri ^a   Goodrich, Joel ^b   Anderson, Richard ^b  

^a Tyco Electronics   (United States)

^b M/A COM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVE DEVICE MODULE (ADM); CRYSTAL PLANE; OPTOELECTRONIC MODULES;

ASSEMBLY; CRYSTAL STRUCTURE; FIBER OPTICS; LASER APPLICATIONS; PHOTOLITHOGRAPHY; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR LASERS; SILICON WAFERS; SUBSTRATES; THROUGHPUT; WAVEGUIDES;

OPTOELECTRONIC DEVICES;

EID: 10444258976     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. st Electronic Components and Technology Conf, 2001
2. st Electronic Components and Technology Conf, 2001
3. Seidel, H., Csepregi, L., Heuberger, A., Baumgartel, H., "Anisotropic Etching of Crystalline Silicon in Alkaline Solutions: I. Orientation Dependance and Behavior of Passivation Layers," Electrochem. Soc., Vol. 137, No. 11 (1990), pp. 41-49.