High thermal dissipation transfer molded package for power modules

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2004, Pages 1825-1830

  Nakajima, Dai ^a   Tada, Kazuhiro ^b   Sasaki, Taichi ^c   Shikano, Takeshi ^c   Kashiba, Yoshihiro ^a  

^a MITSUBISHI ELECTRIC CORPORATION   (Japan)

^b Advanced Technology R and D Center   (Japan)

^c Fukuryo Semicon Engineering Corporation   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CROSS-SECTIONAL VIEWS; POWER CHIPS; POWER MODULES; THERMAL DISSIPATION;

CARBON DIOXIDE; DC MOTORS; ELECTRIC INVERTERS; ENERGY DISSIPATION; FINITE ELEMENT METHOD; HEAT LOSSES; HEAT RESISTANCE; MICROSCOPES; THERMAL INSULATION; THERMOANALYSIS;

ELECTRONICS PACKAGING;

EID: 10444257208     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. S.Noda, K.H.Hussein, S.yamada, G.Majumdar, E.Thal and G.Debelt, "A novel supper compact intelligent power module," PCIM '97, pp.1-9, (1997)
2. John Evans, "Packaging Factors Affecting the Fatigue Life of Power Transistor Die Bonds" IEEE Transactions on Components packaging and manufacturing technology, part A vol.21, No.3, 1998
3. Kenichi Hayashi, "Improvement of Fatigue Life of Solder Joints by Thickness Control of Solder with Wire Bump Technique", ECTC conference proceeding, 2002.
4. Fai Hun, "Pb-free Solder Challenges in Electronic Packaging and Assembly", ECTC conference proceeding, 2003.