Effect of spin coating on the interfacial adhesion of epoxy adhesive on silicon substrate for the fabrication of polymer optical waveguide

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2004, Pages 1900-1902

  Chan, H P ^a   Uddin, M A ^a   Chow, C K ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ADHESIVES; LITHOGRAPHY; OPTICAL MICROSCOPY; OPTICAL WAVEGUIDES; PERMITTIVITY; POLYMERS; SILICON WAFERS; SUBSTRATES; SURFACE ACTIVE AGENTS; SURFACE CHEMISTRY; SURFACE TENSION; THIN FILMS;

EPOXY ADHESIVES; POLYMER CHAIN ORIENTATION; POLYMERIC ADHESIVES; SILICON SUBSTRATES;

SPIN COATING;

EID: 10444235671     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

1. Lee, H. M., Hwang, W.Y., Oh, M., Park, C. H., Zyung, T., Kim, J., "High performance electro-optic polymer
2. Birnie, D. P. "Combined flow and evaporation during spin coating of complex solution "Journal of Non-crystalline solids, 218 (1997) 174-178
3. Goossens, J. G. P., Rastogi, S., Meijer, H. E. H., Lemstra, P. J., "Processing of (in)tractable polymers using reactive solvents. 4: Structure development in the model system poly(ethylene)/styrene" Polymer, Vol. 39, No. 25 (1998) pp 6577-6588
4. Li, X., Han, Y. C., An, L. J., "Surface Morphology Evolution of Thin Triblock Copolymer Films during Spin Coating" Langmuir, Vol. 18 No. 13 (2002), pp 5293-5298
5. Stephan, F. K. et al, "Liquid film coating: scientific principles and their technological implications" Chapman & Hall (London, 1997), pp 713
6. Kim, S. K., Yoo, J.Y., Oh, H. K., "Resist distribution effect of spin coating "Journal of Vacuum Science and Technology B, Vol. 20, No. 6 (2002) pp 2206-2209
7. Birnie, D. P., "Rational solvent selection strategies to combat Striation formation during spin coating of thin films" Journal of Materials Research, Vol. 16, No. 4 (2001), pp 1145-1154
8. Uddin, M. A., Chan, H. P. and Chow, C. K. "Effect of spin coating on the curing rate of epoxy adhesive for the fabrication of polymer waveguide" Journal of Electronic Materials. March 2004,Vol 33, No 3.
9. Connell G., Zenner R. L. D. and Gerber, J. A., "Conductive adhesive flip-chip bonding for bumped and unbumped die" Proceedings 47th Electronic Components and Tech Conf, San Jose, Calif., May. 1997, 274-278.
10. Yarlagadda, P. K. D. V., Stoynov, L. A. and Kim, Ill-Soo., "An investigation into the performance of solar cured adhesive bonded joints" Journal of Materials Processing Technology, Vol. 113 No. 1-3 (2001), pp 160-166.
11. Yacobi, B. G., Martin, S., Davis, K., Hudson, A., Hubert, M., "Adhesive bonding in microelectronics and photonics" Journal of Applied Physics, Vol. 91, No. 10 (2002), pp 6227-6262.