BGA package ball field interaction with manufacturing and design

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 326-333

  Hasan, Altaf ^a   Sato, Daryl ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

PACKAGE BALL FIELD INTERACTION; PRODUCT TYPES; SOLDER JOINT RELIABILITY (SJR); STATISTICAL EQUIVALENCE;

ELECTRONICS PACKAGING; INTEGRATED CIRCUIT LAYOUT; PRINTED CIRCUIT BOARDS; PRODUCT DEVELOPMENT; RELIABILITY; SOLDERING; STATISTICAL METHODS;

FLIP CHIP DEVICES;

EID: 10444231144     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

1. FCBGA Technology Target Specs., Assembly Technology Development, Intel Corp., 2000-2002.
2. SMTD 1mm Pitch BGA Board Development Report, Internal Report, Intel Corp., 2001.
3. Hasan, A., Ball Patterns on FCBGA, Internal report, Intel Corporation, 2001.
4. Hasan, A., 1 mm FCBGA Product Ballouts vs. 'Sacrificial Ball' Design Guidelines, Internal Report, Intel Corporation, 2001.
5. SK Chew, SK Cheng, CS Tay, Eng Huat, and SS Tan, SJR - 1.1 WW49 Summary, Intel Corp., 2001.
6. Alger, B, CSMO-TD PCB Cost Presentation, Internal Report, Intel Corp., 2001.
7. Dungan, J., Board Enabling Focus areas for 2002 & Technology Intercept Plan - ww06, Internal Report, Intel Corp., 2002.
8. Sato, D., 1 mm Package PCB Supplier Capability Final Report, Intel Corp., 2002.
9. Loke, M., Hasan, A., Lee, M., Mong, W., Teng, H., Helms, K., Flip Chip Ball Grid Array Package Coplanarity Analysis - Predictive Model Development and Solution Ideas, Intel Assemble & Test Technology Journal (Internal Document), 2003.