Physical Characteristics of Alumina Coating Using Atmospheric Plasma Spraying (APS) and Low Pressure Plasma Spraying (VPS)

Proceedings of the International Thermal Spray Conference

Volumn , Issue , 2004, Pages 283-285

  Yamasaki, Ryo ^a   Takeuchi, Junichi ^a  

^a TOCALO CO LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; ELASTIC MODULI; ELECTRIC BREAKDOWN; ELECTRIC INSULATION; HEAT RESISTANCE; PLASMA SPRAYING; POWDER METALS; PRESSURE EFFECTS; THERMAL CONDUCTIVITY; THERMAL EXPANSION;

ATMOSPHETIC PLASMA SPRAYING (APS); DISCHARGING ELECTRODES; LOW PRESSURE PLASMA SPRAYING;

SPRAYED COATINGS;

EID: 10444223885     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

1. Y. Harada, "Ceramics Coating Technology," Turbomachinery, 25-2, 123-128, (1997)
2. th International Thermal Spraying Conference, 1083-1089, (1998)
3. J. Takeuchi, proc. of Nippon Zairyou-Gakkai Fushoku-Boushoku Bumon-linkai, vol.139, No.215, pt.2, P.8-15, (2000)
4. Singer, P., "Electrostatic Chucks in Wafer Processing," Semiconductor International, 18 (4), 57-64 (1995)
5. Field, J., "Electrostatic Wafer Clamping for next-Generation Manufacturing," Solid State Technology, 37 (9), 91-98 (1994)
6. C.J. Swindeman, R.D. Seals, W.P. Murray, M.H. Cooper, R.L. White, Practical Solutions for Engineering Problems, Published by ASM International, 793-797, (1996)
7. S. Kuroda, Kouatsu Gas, Published by The High Pressure Gas Society Institute of Japan, vol.29, No.11, P801-807, (1992)
8. K. Tani, H. Nakahira, K. Miyajima, Y. Harada, Materials Transactions, JIM, vol.33, No.6, 618-626, (1992)
9. Ex., Materials properties, Kyocera products catalog, Kyocera Co., Ltd.