Eliminating carbon and watermarks during post-CMP cleaning

Solid State Technology

Volumn 47, Issue 11, 2004, Pages 47-50

  Peters, Darryl W ^a   Bartosh, Kyle ^a   Naghshineh, Shahri ^a   Walker, Elizabeth ^a  

^a ATMI Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BENZOTRIAZOLE (BTA); FRONT-END-OF-LINE (FEOL) PROCESSING; LIGHT POINT DEFECTS (LPD); ORGANOSILICATE GLASS (OSG);

CLEANING; COPPER; GLASS; PH EFFECTS; POINT DEFECTS; SCANNING ELECTRON MICROSCOPY; SILICON; SOLUTIONS; SURFACE ACTIVE AGENTS; WATERMARKING;

CARBON;

EID: 10244264739     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Review

References (3)

1. K. Bartosh, Y. Li, K. Cheemalapti, R. Chowdhury, M. Hughes, D. Peters, Surface Preparation Chemistries for CMP and Post CMP Applications, CAMP Conference, 2003.
2. S. MacKinnon, Proc. Microcontamination, Vol. 94, p. 174, 1994.
3. M. Wantanabe, et al., Materials Science and Engineering, Vol. B4, p. 401, 1989.