Preparation of loading information for reliability simulation

IEEE Transactions on Components and Packaging Technologies

Volumn 27, Issue 4, 2004, Pages 732-735

  Lopez, Leoncio D ^a   Nathan, Swami ^a   Santos, Sarah ^a  

^a SUN MICROSYSTEMS   (United States)

Author keywords

Life cycle load; Virtual qualification (VQ)

Indexed keywords

CERAMIC MATERIALS; COMPUTER SIMULATION; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; MICROPROCESSOR CHIPS; MONTE CARLO METHODS; RELIABILITY;

COMPONENT SOCKET; LAND GRID ARRAY ASSEMBLY; LIFE CYCLE LOAD; VIRTUAL QUALIFICATION (VQ);

CHIP SCALE PACKAGES;

EID: 10244249127     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2004.840092     Document Type: Article

References (3)

1. W. Liu and M. Pecht, IC Component Sockets. New York: Wiley, 2004.
2. H. D. Young and R. A. Freedman, University Physics, 9th ed. Reading, MA: Addison-Wesley, 1996.
3. J. W. Evans and J. Y. Evans, Product Integrity and Reliability in Design. New York: Springer, 2001.