Electrodeposited nickel-manganese: An alloy for microsystem applications

Microsystem Technologies

Volumn 10, Issue 6-7, 2004, Pages 498-505

  Goods, S H ^a   Kelly, J J ^a   Yang, N Y C ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DUCTILITY; ELECTRODEPOSITION; EMBRITTLEMENT; FATIGUE OF MATERIALS; STRAIN; TEXTURES;

ALLOY DEPOSITION; ELECTRODEPOSITED MICROSYSTEMS; MECHANICAL MICROSYSTEM COMPONENTS;

NICKEL ALLOYS;

EID: 10044268795     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-004-0381-8     Document Type: Conference Paper

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