Micromachined atomic force microscopy sensor with integrated piezoresistive sensor and thermal bimorph actuator for high-speed tapping-mode atomic force microscopy phase-imaging in higher eigenmodes

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 21, Issue 6, 2003, Pages 3102-3107

  Pedrak, R ^a   Ivanov, Tzv ^a   Ivanova, K ^a   Gotszalk, T ^a   Abedinov, N ^a   Rangelow, I W ^a   Edinger, K ^b   Tomerov, E ^c   Schenkel, T ^d   Hudek, P ^e  

^a UNIVERSITY OF KASSEL   (Germany)

^b NaWoTec GmbH   (Germany)

^c NTS Ltd   (Bulgaria)

^d LAWRENCE BERKELEY NATIONAL LABORATORY   (United States)

^e Vistec Electron Beam GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ACTUATORS; ATOMIC FORCE MICROSCOPY; CMOS INTEGRATED CIRCUITS; EIGENVALUES AND EIGENFUNCTIONS; ELASTIC MODULI; ELECTRIC EXCITATION; FEEDBACK CONTROL; LITHOGRAPHY; MOSFET DEVICES; PHASE LOCKED LOOPS; PHASE SHIFT; PIEZOELECTRIC DEVICES; SILICON WAFERS; SPUTTERING;

CRITICAL DIMENSIONS (CD); PIEZORESISTIVE SENSORS;

MICROSENSORS;

EID: 0942289200     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1614252     Document Type: Conference Paper

References (26)

1. Q. Zhong, D. Imniss, K. Kjoller, and V. B. Elings, Surf. Sci. 290, L688 (1993).
2. M. Tortonese, R. C. Barrett, and C. F. Quate, Appl. Phys. Lett. 62, 834 (1993).
3. K J. Giessibl and B. M. Trafas, Rev. Sci. Instrum. 65, 1923 (1994).
4. W. Barth et al., Microelectron. Eng. 57-58, 825 (2000).
5. R. P. Reid et al., Int. Solid-State Sens. Actuators Conf., 1997, p. 447.
6. N. Abedinov et al., J. Vac. Sci. Technol. A 19, 2884 (2001).
7. A. Volodin and C. Van Haesendonck, Appl. Phys. A: Mater. Sci. Process. A66, 305 (1998).
8. K. E. Petersen, IBM J. Res. Dev. 24, 631 (1980).
9. T. Itoh, T. Ohashi, and T. Suga, J. Vac. Sci. Technol. B 14, 1577 (1996).
10. S. Timoshenko, J. Opt. Soc. Am. 11, 233 (1925).
11. R. Linnemann, T. Gotszalk, L. Hadjiiski, and I. W. Rangelow, Thin Solid Films 264, 159 (1995).
12. T. Ivanov, T. Gotszalk, T. Sulzbach, and I. W. Rangelow, Ultramicroscopy 97, 377 (2003).
13. T. Ivanov, T. Gotszalk, T. Sulzbach, I. Chakarov, and I. W. Rangelow, Microelectron. Eng. 67-68C, 534 (2003).
14. T. Itoh, C. Lee, and T. Suga, Appl. Phys. Lett. 69, 2036 (1996).
15. T. Fujii, S. Watanabe, M. Suzuki, and T. Fujiu, J. Vac. Sci. Technol. B 13, 1119 (1995).
16. M. Despont et al. Proceedings of the MEMS 2000 Conference, Miyazaki, Japan, 2000, p. 126.
17. D. Lange et al., Proceedings of the MEMS'99 Conference, Orlando, FL, 1999, p. 447.
18. K. Y. Yasumura, T. D. Stowe, E. M. Chow, T. Pfafman, T. W. Kenny, B. C. Stipe, and D. Rugar, J. Microelectromech. Syst. 9, 117 (2000).
19. W. Riethmuller and W. Beneeke, IEEE Trans. Electron Devices 35, 758 (1988).
20. Chui et al., J. Microelectromech. Syst. 7, 69 (1998).
21. J. Bühler, J. Funk, O. Paul, F.-P. Steiner, and H. Baltes, Sens. Actuators A 46-47, 572 (1995).
22. I. W. Rangelow et al., Proc. SPIE 2879, 56 (1996).
23. I. W. Rangelow, Proc. SPIE 1392, 180 (1990).
24. T. Itoh and T. Suga, in Proceedings of Transducers'95, Stockholm, Sweden, Royal Swedish Academy of Engineering Science IVA, Stockholm, 1995, p. 632.
25. Tzv. Ivanov, T. Gotszalk, P. Grabiee, E. Tomerov, and I. W. Rangelow, Microelectron. Eng. 67-68C, 550 (2003).
26. W.-J. Chang, Nanotechnology 13, 510 (2002).