Magnetically Controlled Electroplating of NiFe/Cu Composite Wires

Electrochemical and Solid-State Letters

Volumn 7, Issue 1, 2004, Pages

  Li, X P ^a   Zhao, Z J ^a   Seet, H L ^a   Heng, W M ^a   Oh, T B ^a   Lee, J Y ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

MAGNETOIMPEDANCE (MI) EFFECTS; MAGNIFICATION; PLATING CURRENT;

ELECTRIC IMPEDANCE; ELECTRODEPOSITION; ELECTROLYTES; ENERGY DISPERSIVE SPECTROSCOPY; FERROMAGNETIC MATERIALS; MAGNETIC ANISOTROPY; MAGNETIC FIELDS; MASS TRANSFER; MICROSTRUCTURE; MORPHOLOGY; NICKEL COMPOUNDS; PH EFFECTS; SCANNING ELECTRON MICROSCOPY; STAINLESS STEEL; STRESSES; WIRE;

ELECTROPLATING;

EID: 0942288686     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1625593     Document Type: Article

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