Electrochemical deposition of cupric ions for the determination of mass transfer rates to a stepped rotating cylinder electrode

Transactions of the Institute of Metal Finishing

Volumn 81, Issue 5, 2003, Pages 141-147

  Kear, G ^a   Purchase, A ^a   Bremhorst, K ^a  

^a UNIVERSITY OF QUEENSLAND   (Australia)

Author keywords

Convective diffusion; Copper; Direct numerical simulation (DNS); Disturbed flow, flow modelling; Electrodeposition; Rotating cylinder electrode (RCE); Stepped rotating cylinder electrode (SRCE)

Indexed keywords

COMPUTATIONAL GEOMETRY; COMPUTER SIMULATION; CORROSION; ELECTRODEPOSITION; ELECTRODES; MAPPING; MASS TRANSFER; OPTICAL RESOLVING POWER; SCANNING ELECTRON MICROSCOPY; TURBULENT FLOW;

FLOW MODELING; ROTATING CYLINDER ELECTRODES (RCE);

ELECTROCHEMISTRY;

EID: 0842331982     PISSN: 00202967     EISSN: None     Source Type: Journal    
DOI: 10.1080/00202967.2003.11871524     Document Type: Article

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