Thermal Stability and Deposition Behaviors of Ru Thin Films Prepared by Using Metalorganic Chemical Vapor Deposition

Journal of the Korean Physical Society

Volumn 44, Issue 1, 2004, Pages 25-29

  Kang, Sang Yeol ^a   LIM, Ha Jin ^a   Hwang, Cheol Seong ^a   Kim, Hyeong Joon ^a  

^a Seoul National University   (South Korea)

Author keywords

MOCVD; Ru; Thermal stability; Ti doped Ru

Indexed keywords

EID: 0842329001     PISSN: 03744884     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Conference Paper

References (8)

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