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Volumn 101, Issue 1, 2003, Pages 18-24
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Coating plastics with nonstoichiometric copper sulfide to facilitate copper electroplating: Electrochemical prerequisites
a a a |
Author keywords
[No Author keywords available]
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Indexed keywords
ABS RESINS;
CATHODIC PROTECTION;
COPPER COMPOUNDS;
ELECTRODEPOSITION;
ELECTROLYTES;
IONS;
REDUCTION;
SOLUTIONS;
TEMPERATURE DISTRIBUTION;
THIN FILMS;
COPPER ELECTRODEPOSITION;
LIGANDS;
NONSTOICHIOMETRIC COPPER SULFIDE (NCS);
POLARIZATION CURVES (PC);
ELECTROCHEMISTRY;
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EID: 0742330854
PISSN: 00260576
EISSN: None
Source Type: Journal
DOI: 10.1016/S0026-0576(03)80005-3 Document Type: Article |
Times cited : (6)
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References (15)
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