Rhenium plating

Metal Finishing

Volumn 101, Issue 6, 2003, Pages 86-96

  Jones, Terence ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRODEPOSITION; ELECTROLYTES; HYDROGEN; LUBRICANTS; RHENIUM PLATING; SILVER; SUPERALLOYS; VACUUM;

ELECTROPLATING ELECTROLYTES; PERRHENATE IONS; RADIOACTIVE IMAGING; YELLOW HEPTOXIDE;

RHENIUM;

EID: 0742330786     PISSN: 00260576     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-0576(03)80439-7     Document Type: Article

References (44)

1. Sigma-Aldrich catalogue, UK edition; 2000-2001
2. U.S. Patent 6,162,552; 2000
3. Britannica.com; 2001
4. see, e.g., Rhenium Alloys, Inc.; www.rhenium.com
5. Japan Patent 70,006, 150-B; 1970
6. U.S. Patent 5,817,371; 1998
7. Mackay & Mackay, "Modern Inorganic Chemistry", 4th edition; Blackie/Prentice & Hall: 1989. (For N. America the ISBN is 0-13-488487-6)
8. Meyer, A.R., Trans. I.M.F., 46:209-212; 1968
9. DePew, J.R. and T.L. Larson, Plating, May, pp475-478; 1970
10. Camp E.K., Plating, May 1965, pp413-416
11. Greco V.P., Plating, Feb 1972, pp115-125
12. Meyer, A.R., PhD thesis, University of Geneva (in French);
13. also, in French, in Oberflaeche-Surface, 11, 1970;
14. Meyer, A.R., Oberflaeche-Surface, Heft (issue) 3, pp 84-86;
15. Meyer, A.R., Oberflaeche-Surface, 4, pp 117-122;
16. Meyer, A.R., Oberflaeche-Surface, 6, pp 208-213;
17. Meyer, A.R., Oberflaeche-surface 7, pp 231-232;
18. Meyer, A.R., Oberflaeche-Surface, 8 pp 248-251
19. Gvozdeva, I.I., Elekhomet. Tsvetnykt Metal, 188, 212, (1957),
20. & Sklyarenko S I et al, Akad. Nauk. SSSR,Inst. Met. 100; 1958
21. Bond, G.C. et al., J. Electroanal. Chem. 34:1-2: 1972
22. U.S. Patent 3,668,083-A; 1970
23. U.S. Patent 5,330,088; 1994
24. Tsuru, T., et al., J. Surface Finishing Soc. Japan; 47:883-4; 1996 (in Japanese)
25. Turns, E.W., Plating, 2:127-131; 1971
26. Turns, E.W., et. al, U.S. Patent 3,342,708; 1967
27. Fukushima, H., et al., Metal Finishing, 83(3):37-41; 1985
28. Fukushima, H., et al.,Metal Finishing, 84(12):15-18; 1986
29. Berezina, S.I., et al., Metallov, 29:106-110; 1993
30. Berezina, S.I., et al., Metallov, 28:282; 1992
31. U.S. Patent 3,890,210 -A; 1975
32. European Patent 913,501-A; 1999
33. Japan Patents 52,052,106-A, 84,042,066-B; 1977
34. Japan Patent 62001122-A; 1987
35. Japan Patent 63111195-A, US Patent 4,778,573-A; 1988
36. Russian Patent SU396438-A; 1974
37. Pearlstein, F. & R.F. Weightman, Plating, 6:714-716; 1967
38. Pearlstein, F. & R.F. Weightman Electrochemical Technology, Nov.-Dec.:427-430; 1968
39. Takano, O, & H. Matsuda, Metal Finishing, 84(6):60-64; 1986
40. Takano, O, et al., Japan Met. Fin. Soc., 85(9):440-44; 1984
41. Homma, T. & T.J. Osaka, Electrochem. Society, 139(10):2925-2929; 1992
42. Vaskelis, A, Galvanotechnik, 87(2); 1996
43. Hosokawa, et al., Plating & Surface Finishing, 10:52-55; 1980
44. Hosokawa K. et al., Proceedings of INTERFINISH 80, pp 58-62