Investigation of interfacial delamination of a copper-epoxy interface under monotonic and cyclic loading: Modeling and evaluation

IEEE Transactions on Advanced Packaging

Volumn 26, Issue 4, 2003, Pages 441-446

  Xie, Weidong ^a   Sitaraman, Suresh K ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Delamination propagation; Fatigue crack propagation; Interfacial integrity; Numerical modeling

Indexed keywords

COPPER; CRACK PROPAGATION; CRACKS; DELAMINATION; DESIGN FOR TESTABILITY; EPOXY RESINS; INTERFACES (MATERIALS); NUMERICAL METHODS; SUBSTRATES;

COPPER EPOXY INTERFACE; CYCLIC LOADING; DELAMINATION PROPAGATION; FATIGUE CRACK PROPAGATION; INTERFACIAL DELAMINATION; MONOTONIC LOADING;

ELECTRONICS PACKAGING;

EID: 0742321346     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2003.821087     Document Type: Article

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