Flame resistant glass-epoxy printed wiring boards with no halogen or phosphorus compounds

Journal of Materials Science: Materials in Electronics

Volumn 15, Issue 3, 2004, Pages 175-182

  Iji, Masatoshi ^a   Kiuchi, Yukihiro ^a  

^a NEC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COMBUSTION; CURING; DECOMPOSITION; ENVIRONMENTAL IMPACT; ESTERS; FLAME RESISTANCE; GLASS FIBERS; GLASS TRANSITION; HYDROPHOBICITY; IGNITION; PHOSPHORUS COMPOUNDS; PYROLYSIS; THERMAL EXPANSION; XYLENE;

FOAM LAYERS; HOLE DRILLING; PRINTED WIRING BOARDS (PWD);

EPOXY RESINS;

EID: 0742320324     PISSN: 09574522     EISSN: None     Source Type: Journal    
DOI: 10.1023/B:JMSE.0000011358.70618.00     Document Type: Article

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