Effect of sintering additives on the nitridation behavior of reaction-bonded silicon nitride

Materials Science and Engineering: A

Volumn 364, Issue 1-2, 2004, Pages 126-131

  Lee, Byong Taek ^a   Kim, Hai Doo ^b  

^a Kongju National University   (South Korea)

^b Korea Institute of Machine and Materials   (South Korea)

Author keywords

Microstructures; Nitridation behavior; Reaction bonded Si3N4; Silicon nitride

Indexed keywords

ADDITIVES; GRAIN BOUNDARIES; MICROSTRUCTURE; SINTERING;

SILICON COMPACTS;

SILICON NITRIDE;

CERAMICS;

EID: 0742305233     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2003.07.005     Document Type: Article

References (12)

1. T.N. Tiegs, J.O. Kiggans Jr., K.L. Ploetz, Ceram. Eng. Sci. Proc. 14 (1993) 378.
2. G. Ziegler, J. Mater. Sci. 22 (1987) 3041.
3. B.-T. Lee, H.-D. Kim, Mater. Trans, JIM 37 (1996) 1547.
4. B.-T. Lee, H.G. Jeong, K. Hiraga, Mater. Trans. JIM 43 (2002) 19.
5. B.-T. Lee, J.H. Yoo, H.-D. Kim, Mater. Trans. JIM 41 (2000) 312.
6. B.-T. Lee, H.-D. Kim, J. Mater. Sci. 34 (1999) 6169.
7. P.F. Becher, E.Y. Sun, K.P. Plucknett, K.B. Alexander, C.H. Hsueh, H.T. Lin, S.B. Waters, C.G. Westmonreland, E.S. Kang, K. Hirao, M.E. Brito. J. Am. Ceram. Soc. 81 (1998) 2821.
8. B.-T. Lee, J.H. Yoo, H.-D. Kim, Mater. Sci. Eng. A333 (2002) 306.
9. C.P. Gazzara, D.R. Messier, Am. Ceram. Soc. Bull. 56 (1997) 777.
10. T.N. Tiegs, F.C. Montgomery, J.L. Schroeder, D.L. Barker, P.A. Menchhofer. Ceram. Eng. Sci. Proc. 18 (1997) 437.
11. B.-T. Lee, T. Koyama, A. Nishiyama, K. Hiraga, Scrip. Meta. Mater. 32 (1995) 1073.
12. S. Hamishire, M. Pomeroy, Ann. Chim. Fr. 10 (1985) 65.