A numerical study of the hygro-mechanical deformation of two cardboard layups

Composites Science and Technology

Volumn 64, Issue 5, 2004, Pages 619-627

  Gendron, G ^a   Dano, M L ^a   Cloutier, A ^a  

^a UNIVERSITÉ LAVAL   (Canada)

Author keywords

C. Computational simulation; C. Deformation; C. Finite element analysis (FEA); C. Laminates; Cardboard

Indexed keywords

FINITE ELEMENT METHOD; MOISTURE; PLASTIC DEFORMATION; STRAIN;

HYDROMECHANICAL DEFORMATIONS;

COMPOSITE MATERIALS;

COMPOSITE;

EID: 0742302289     PISSN: 02663538     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.compscitech.2003.06.002     Document Type: Article

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