Direct Metallization Using Sulfonation of Thermosetting Polyphenylene Ether Resin Laminate

Plating and Surface Finishing

Volumn 85, Issue 7, 1998, Pages 52-54

  Nawafune, H ^a   Kanai, T ^a   Mizumoto, S ^a   Seita, M ^b  

^a KONAN UNIVERSITY   (Japan)

^b LeaRonal Japan Inc   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0542442705     PISSN: 03603164     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (4)

1. Karl H. Dietz, Plat. and Surf. Fin., 82, 60 (June 1995).
2. T. Arai, H. Oda & T. Katayose, Electronic Circuit & Packaging Technology, 9, 429 (1994).
3. C.J. Pouchert, The Aldrich Library of FT-IR Spectra, 2, 1209 (1985).
4. C.J. Pouchert, ibid., 1, 813 (1985).