The Low-Temperature Mechanical Behavior of Molybdenum-Rhenium

JOM

Volumn 55, Issue 10, 2003, Pages 25-29

  Agnew, S R ^a   Leonhardt, T ^b  

^a UNIVERSITY OF VIRGINIA   (United States)

^b R and D at Rhenium Alloys   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP; DUCTILITY; ELECTRONIC STRUCTURE; GRAIN BOUNDARIES; HIGH TEMPERATURE EFFECTS; LOW TEMPERATURE EFFECTS; METALLOGRAPHY; RHENIUM ALLOYS; SOLID SOLUTIONS; STRENGTH OF MATERIALS; TWINNING;

CREEP RESISTANCE; LOW-TEMPERATURE DUCTILITY; SOLID-SOLUTION SOFTENING;

MOLYBDENUM ALLOYS;

EID: 0348209085     PISSN: 10474838     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11837-003-0171-2     Document Type: Article

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