A fast algorithm for detecting die extrusion defects in IC packages

Machine Vision and Applications

Volumn 11, Issue 1-2, 1998, Pages 37-41

  Zhou, Huiyang ^a   Kassim, Ashraf A ^a,b   Ranganath, Surendra ^a,c,d  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b CARNEGIE MELLON UNIVERSITY   (United States)

^c UNIVERSITY OF CALIFORNIA   (United States)

^d PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

Die extrusion defects; Feature enhancement; IC package inspection; Linear feature extraction

Indexed keywords

ALGORITHMS; DEFECTS; ELECTRONICS PACKAGING; EXTRUSION; FEATURE EXTRACTION; INSPECTION; INTEGRATED CIRCUIT MANUFACTURE;

DIE EXTRUSION DEFECTS; FEATURE ENHANCEMENT;

COMPUTER VISION;

EID: 0348203685     PISSN: 09328092     EISSN: None     Source Type: Journal    
DOI: 10.1007/s001380050088     Document Type: Article

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