Novel Simulation Techniques for Design of Air-cooled Electronics

Advances in Electronic Packaging

Volumn 2, Issue , 2001, Pages 647-652

  Johnson, David A ^a   Welch, Mark J ^a   Cullimore, Brent A ^a  

^a C and R Technologies Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FLUID NETWORK MODELING (FNM); THERMAL NETWORK ANALYZERS;

AIR; APPROXIMATION THEORY; COMPUTATIONAL FLUID DYNAMICS; COMPUTER AIDED DESIGN; COMPUTER SIMULATION; COOLING; ENERGY CONSERVATION; FINITE ELEMENT METHOD; HEAT SINKS; HEAT TRANSFER; HEAT TRANSFER COEFFICIENTS; THERMOANALYSIS;

ELECTRONICS PACKAGING;

EID: 0348199132     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Panczak et al, Thermal Desktop Version 3.3 User's Manual and tutorials, PDF available at www.crtech.com, December 2000
2. Cullimore et al, SINDA/FLUINT Version 4.4 User's Manual, PDF available at www.crtech.com, May 2001
3. Cullimore, B., "Dealing with Uncertainties and Variations in Thermal Design," IPACK2001-15516, July 2001
4. Moore, G., "The Continuing Silicon Technology Evolution Inside the PC Platform," developer.intel.com/update/archive/issue2/feature.htm, May 2000