-
1
-
-
0032660348
-
Smart integration and packaging of 2-D VCSELs for high-speed parallel links
-
Sept/Oct.
-
H. Kosaka, "Smart integration and packaging of 2-D VCSELs for high-speed parallel links," IEEE J. Select. Topics Quantum Electron., vol. 5, pp. 184-192, Sept/Oct. 1999.
-
(1999)
IEEE J. Select. Topics Quantum Electron.
, vol.5
, pp. 184-192
-
-
Kosaka, H.1
-
2
-
-
0034483657
-
ParaBIT-1: 60-Gb/s-throughput parallel optical interconnection module
-
M. Usui, N. Sato, A. Ohki, N. Matsuura, N. Tanaka, K. Enbutsu, M. Amano, M. Hikita, T. Kagawa, K. Katsura, and Y. Ando, "ParaBIT-1: 60-Gb/s-throughput parallel optical interconnection module," in Proc. 50th Electron. Component and Technol. Conf., 2000, pp. 1252-1258.
-
(2000)
Proc. 50th Electron. Component and Technol. Conf.
, pp. 1252-1258
-
-
Usui, M.1
Sato, N.2
Ohki, A.3
Matsuura, N.4
Tanaka, N.5
Enbutsu, K.6
Amano, M.7
Hikita, M.8
Kagawa, T.9
Katsura, K.10
Ando, Y.11
-
3
-
-
0034476688
-
Current progress of advanced high speed parallel optical links for computer clusters and switching systems
-
K. Drögemüler, D. Kuhl, J. Blank, M. Ehlert, T. Kracker, J. Hohn, D. Klix, V. Plickert, L. Melchior, L. Schmale, P. Hildebrandt, M. Heinemann, F. P. Schiefelbein, L. Leininger, H.-D. Wolf, T. Wipiejewski, and A. Ebberg, "Current progress of advanced high speed parallel optical links for computer clusters and switching systems," in Proc. 50th Electron. Component and Technol. Conf., 2000, pp. 1227-1235.
-
(2000)
Proc. 50th Electron. Component and Technol. Conf.
, pp. 1227-1235
-
-
Drögemüler, K.1
Kuhl, D.2
Blank, J.3
Ehlert, M.4
Kracker, T.5
Hohn, J.6
Klix, D.7
Plickert, V.8
Melchior, L.9
Schmale, L.10
Hildebrandt, P.11
Heinemann, M.12
Schiefelbein, F.P.13
Leininger, L.14
Wolf, H.-D.15
Wipiejewski, T.16
Ebberg, A.17
-
4
-
-
0347458124
-
Design of an optical coupling structure for parallel optical interconnection modules
-
S.-P. Han, W.-J. Lee, B. C. Kim, C.-G. Choi, S.-H. Ahn, and M.-Y. Jeong, "Design of an optical coupling structure for parallel optical interconnection modules," in Int. Topical Meeting Photonics in Switching (PS 2002), 2002, pp. 199-201.
-
(2002)
Int. Topical Meeting Photonics in Switching (PS 2002)
, pp. 199-201
-
-
Han, S.-P.1
Lee, W.-J.2
Kim, B.C.3
Choi, C.-G.4
Ahn, S.-H.5
Jeong, M.-Y.6
-
5
-
-
0028950885
-
Deep X-ray lithography for the production of three-dimensional microstructures from metals, polymers and ceramics
-
W. Ehrfeld and H. Lehr, "Deep X-ray lithography for the production of three-dimensional microstructures from metals, polymers and ceramics," Radiat. Phys. Chem., vol. 45, no. 3, pp. 349-365, 1995.
-
(1955)
Radiat. Phys. Chem.
, vol.45
, Issue.3
, pp. 349-365
-
-
Ehrfeld, W.1
Lehr, H.2
-
6
-
-
0001725324
-
Requirements on resist layers in deep-etch synchrotron radiation lithography
-
J. Mohr, W. Ehrfeld, and D. Munchmeyer, "Requirements on resist layers in deep-etch synchrotron radiation lithography," J. Vac. Sci. Technol., vol. B6, pp. 2264-2267, 1988.
-
(1988)
J. Vac. Sci. Technol.
, vol.B6
, pp. 2267
-
-
Mohr, J.1
Ehrfeld, W.2
Munchmeyer, D.3
-
7
-
-
0032289383
-
PMMA development studies using various synchrotron sources and exposure conditions
-
M. X. Tan, M. A. Bankert, S. U. Griffiths, A. Ting, D. R. Boehme, S. Wilson, and L. M. Balser, "PMMA development studies using various synchrotron sources and exposure conditions," SPIE, vol. 3512, pp. 262-270, 1998.
-
(1998)
SPIE
, vol.3512
, pp. 262-270
-
-
Tan, M.X.1
Bankert, M.A.2
Griffiths, S.U.3
Ting, A.4
Boehme, D.R.5
Wilson, S.6
Balser, L.M.7
-
8
-
-
0038201481
-
Fabrication of large-core 1 × 16 optical power splitters in polymers using hot-embossing process
-
June
-
C.-G. Choi, S.-P. Han, S.-H. Ahn, and M.-Y. Jeong, "Fabrication of large-core 1 × 16 optical power splitters in polymers using hot-embossing process," IEEE Photon. Technol. Lett., vol. 15, pp. 825-827, June 2003.
-
(2003)
IEEE Photon. Technol. Lett.
, vol.15
, pp. 825-827
-
-
Choi, C.-G.1
Han, S.-P.2
Ahn, S.-H.3
Jeong, M.-Y.4
|