Investigation of the Shear Stresses Experienced during Melting Using Novel Microencapsulated Dye Sensors

Journal of Reinforced Plastics and Composites

Volumn 18, Issue 2-3, 1999, Pages 271-278

  Clark, D C ^a   Geramita, K ^a   Baker, W E ^a  

^a QUEEN S UNIVERSITY   (Canada)

Author keywords

Extrusion; Melting; Microcapsule; Shear stress

Indexed keywords

DYES; MELTING; PLASTICS EXTRUDERS; SENSORS; SHEAR STRESS; STRESS ANALYSIS;

MICROENCAPSULATED DYE SENSORS; SINGLE SCREW EXTRUDERS;

POLYMER BLENDS;

EID: 0347810389     PISSN: 07316844     EISSN: None     Source Type: Journal    
DOI: 10.1177/073168449901800307     Document Type: Article

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