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Volumn 1998-April, Issue , 1998, Pages 167-172
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A compact modeling approach using a genetic algorithm for accurate thermal simulation
a a a
a
IBM JAPAN LTD
(Japan)
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Author keywords
[No Author keywords available]
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Indexed keywords
BOUNDARY CONDITIONS;
GENETIC ALGORITHMS;
MICROELECTRONICS;
THERMAL CONDUCTIVITY;
CALCULATION ACCURACY;
CALCULATION TIME;
COMPONENT MODELING METHOD;
COMPUTER PERFORMANCE;
DESIGN SIMPLIFICATION;
MODEL SIMPLIFICATION;
OPTIMAL THERMAL DESIGN;
THERMAL SIMULATIONS;
COMPUTER AIDED DESIGN;
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EID: 0347781473
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/IEMTIM.1998.704552 Document Type: Conference Paper |
Times cited : (1)
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References (4)
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