Surface graft copolymerization enhanced lamination of poly(tetrafluoroethylene) film to copper and epoxy-based print circuit board (pcb)

Journal of Electronic Packaging, Transactions of the ASME

Volumn 121, Issue 4, 1999, Pages 291-296

  Kang, E T ^b   Cui, C Q ^a   Cui, T B ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0347718215     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2793855     Document Type: Article

References (23)

1. Nicholson, M. E., ed., 1987, Pro. Electr. Packaging and Corrosion in Microelectronics, ASM International.
2. Salmon, E. R., 1987, Encapsulation of Electronic Devices and Components, M. Dekker Ed., New York and Basel.
3. St. Clair, A. K., St. Clair, T. L., and Winfree, W. P., 1988, Polymerie Materials Science and Engineering, Vol. 59, p. 28.
4. Sacher, E., 1994, Prog. in Surf. Sd., Vol. 47, No. 3, p. 273.
5. Strobel, M., Lyons, C. S., and Mittal, K. L., 1994, eds., Plasma Surface Modification of Polymers: Relevance to Adhesion, VSP, Utrecht, The Netherlands.
6. Shi, M. K., Martinu, L., Sacher, E., Selmani, A., Wertheimer, M. R., and Yelon, A., 1995, Surf, lnterf Anal., Vol. 23, p. 99.
7. Inagaki, N., Tasaka, S., and Kawai, H., 1989, J, Adhesion Sei. Technol., Vol. 3, p. 637.
8. Kinbara, A., Kikuchi, A., Baba, S., and Abe, T., 1993, J. Adhesion Sei. Technol, Vol. 7, p. 457.
9. Gengenbach, T. R., Xie, X. M., Chatelier, R. C., and Griesser, H. J., 1994, J. Adhesion Sei. Technol, Vol. 8, p. 305.
10. Golub, M. A., Lopata, E. S., Finney, L. S., 1994, Langmuir, Vol. 10, p. 3629.
11. Suzuki, M., Kishida, A., Iwata, H., Ikada, Y., 1986, Macromolecules, Vol. 19, p. 1804.
12. Ikada, Y., 1994, Biomaterials, Vol. 15, p. 725.
13. Tan, K. L., Woon, L. L., Wong, H. K., Kang, E. T., and Neoh, K. G., 1993, Macromolecules, Vol. 26, p. 2832.
14. Kang, E. T., Neoh, K. G., Chen, W., Tan, K. L., Huang, C. C., and Liaw, D. J., 1996, J. Adhesion Sei. Technol, Vol. 10, p. 725.
15. Wang, T., Kang, E. T., Neoh, K. G., Tan, K. L., Cui, C. Q„ and Lim, T. B„ 1997, J. Adhesion Sei. Technol, Vol. 11, p. 679.
16. Yang, W. T., and Ranby, B., 1996, J. Appl Polym. Sei, Vol. 62, p. 533.
17. Yang, W. T., and Ranby, B., 1996, J. Appl Polym. Sei., Vol. 62, p. 545.
18. Ranby, B., 1990, J. Adhesion Sd. Technol, Vol. 9, p. 599.
19. Wang, T., Kang, E. T., Neoh, K. G., Fuh, J. Y. H., Lu, L., and Nee, A. Y. C., 1997, J. Adhesion Sei. Technol, Vol. 11, p. 1211.
20. Elliott, S. T., 1973, in: Handbook of Adhesive Bonding, Cagle, C. V., ed., McGraw-Hill, New York. pp. 18-20.
21. Da, Y. X., Griesser, H. J., Mau, A. W. H., Schmidt, R., and Liesegang, J., 1991, Polymer, Vol. 32, p. 1126.
22. Iwata, H., Kishida, A., Suzuki, M., Hata, Y., and Ikada, Y., 1988, J. Polym. Sei. Part A: Polym. Chem., Vol. 26, p. 3309.
23. Lee, Leng-Huang, 1984, ed., Adhesive Chemistry: Developments and Trends, Plenum Press, New York.