6F-polyimides with phenylethynyl endcap for 315-370°C applications

High Performance Polymers

Volumn 15, Issue 4, 2003, Pages 459-472

  Chuang, Kathy C ^a   Bowman, Cheryl L ^a   Tsotsis, Thomas K ^b   Arendt, Cory P ^b  

^a NASA GLENN RESEARCH CENTER   (United States)

^b BOEING COMPANY   (United States)

Author keywords

Phenylethynyl endcap; Polyimides; Rapid heating; Resin infusion; Thermal cycling

Indexed keywords

DELAMINATION; HEATING; MECHANICAL PROPERTIES; PHYSICAL PROPERTIES; POLYIMIDES; POLYMERIZATION; TEMPERATURE; THERMAL CYCLING; THERMODYNAMIC STABILITY;

BLISTERING; CRYOGENIC TEMPERATURE; ELEVATED TEMPERATURE; MICROCRACK RESISTANCE; PHENYLETHYNYL ENDCAP; POLYMERIZATION OF MONOMER REACTANT; RAPID HEATING; RESIN INFUSION; THERMO-OXIDATIVE STABILITY;

CARBON FIBER REINFORCED PLASTICS;

EID: 0347622569     PISSN: 09540083     EISSN: None     Source Type: Journal    
DOI: 10.1177/0954008303015004005     Document Type: Article

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