Assembly processes for flip chips on substrates

Advanced Packaging

Volumn 12, Issue 11, 2003, Pages 37-39

  Geiger, David A ^a   Sjoberg, Jonas ^a   Wong, Patrick ^a   Shangguan, Dongkai ^a  

^a FLEXTRONICS INTERNATIONAL   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTIVE FILMS; ELECTROLESS PLATING; EUTECTICS; FLIP CHIP DEVICES; RELIABILITY; SOLDERING; SUBSTRATES; SURFACE MOUNT TECHNOLOGY; THERMAL CYCLING; THICKNESS MEASUREMENT; VIBRATIONS (MECHANICAL);

PICK AND PLACE SYSTEM; REFLOW PROCESS; SOLDER FLIP CHIP DEVICES;

ELECTRONICS PACKAGING;

EID: 0347596505     PISSN: 10650555     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (0)