Structure and properties of polysilsesquioxanes and copolymers for ultra-low dielectric films

Materials Research Society Symposium - Proceedings

Volumn 766, Issue , 2003, Pages 241-251

  Yoon, Do Y ^a   Ro, Hyun Wook ^a   Park, Eun Su ^a   Lee, Jin Kyu ^a   Kim, Hie Joon ^a   Char, Kookheon ^a   Rhee, Hee Woo ^b   Kwon, Dongil ^a   Gidley, David W ^c  

^a Seoul National University   (South Korea)

^b Sogang University   (South Korea)

^c UNIVERSITY OF MICHIGAN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPOLYMERS; ELASTIC MODULI; ELECTRIC INSULATORS; FUNCTIONAL POLYMERS; HARDNESS; LOGIC DEVICES; MICROSTRUCTURE; NANOSTRUCTURED MATERIALS; PERMITTIVITY; POROSITY;

CRACK RESISTANCE; FUNCTIONAL PROPERTIES; POLYSILSESQUIOXANES; STRUCTURE-PROPERTY RELATIONSHIPS;

DIELECTRIC MATERIALS;

EID: 0347569401     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-766-e6.5     Document Type: Conference Paper

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