Detection of voids in tungsten interconnect vias using laser-induced surface acoustic waves

Materials Research Society Symposium - Proceedings

Volumn 766, Issue , 2003, Pages 421-425

  Tower, Joshua ^a   Gostein, Michael ^a   Otsubo, Koichi ^b   Kawasaki, Atsushi ^c  

^a PHILIPS RESEARCH LABORATORIES   (Germany)

^b Philips Adv Metrology Systems Inc   (Japan)

^c RENESAS TECHNOLOGY CORP   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL VAPOR DEPOSITION; CRYSTAL DEFECTS; LASER APPLICATIONS; NUCLEATION; SCANNING ELECTRON MICROSCOPY; THERMAL EFFECTS; THICKNESS MEASUREMENT; TITANIUM NITRIDE; TUNGSTEN;

PLUG FILLING; TUNGSTEN INTECONNECT; VOIDS;

ACOUSTIC SURFACE WAVE DEVICES;

EID: 0347569294     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-766-e3.4     Document Type: Conference Paper

References (2)

1. M. Gostein, et al, "Thin Film Metrology Using Impulsive Stimulated Thermal Scattering (ISTS)," in Handbook of Silicon Semiconductor Metrology, ed. Alain Diebold (Marcel Dekker, New York, 2002), pp. 167-196.
2. M. Gostein, M. Joffe, A.A. Maznev, M. Banet, C.J.L. Moore, "Non-Contact Metal Film Metrology Using Impulsive Stimulated Thermal Scattering," in Characterization and Metrology for ULSI Technology, ed. D.G. Seiler et al, AIP Conference Proceedings Volume 550 (American Institute of Physics: Melville, New York, 2000), pp. 478-488.