Thin-film embedded resistor and capacitor technologies

Circuit World

Volumn 30, Issue 1 Embedded Passives Technology, 2004, Pages 16-19+4+6+8

  Chinoy, Percy ^a   Langlois, Marc ^a  

^a SHIPLEY COMPANY   (United States)

Author keywords

Capacitors; Printed circuit boards; Resistors

Indexed keywords

CAPACITORS; EMBEDDED SYSTEMS; PRINTED CIRCUIT BOARDS; THIN FILMS;

CAPACITANCE DENSITIES;

RESISTORS;

EID: 0347385183     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056120410496333     Document Type: Article

References (5)

1. Chinoy, P. and Hariharan, R. (2003), "Thermal and ESD characteristics of high ohmic value embedded resistors", Proceedings of IPC Embedded Passives Conference, June 2003, Northbrook, Illinois.
2. (tm) embedded resistor and capacitor technologies", Proceedings of IPC Expo, March 2003, Long Beach.
3. Chinoy, P., Langlois, M. and Schemenaur, J. (2002), "High ohmic value embedded resistor material", Circuitree.
4. Funer, R. (2002), "Embedding resistors and capacitors", Printed Circuit Design.
5. (tm) high ohmic value embedded resistor material", Proceedings of ECWC Symposium, October 2002, Cologne.