Minimizing failures in electronic systems by design

EDN

Volumn 45, Issue 16, 2000, Pages 87-104

  Lakshminarayanan, V ^a,b  

^a INDIAN INSTITUTE OF SCIENCE   (India)

^b CENTRE FOR DEVELOPMENT OF TELEMATICS   (India)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0347370554     PISSN: 00127515     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (12)

1. MIL-HDBK-202: Test Methods for Electronic and Electrical Component Parts.
2. Amerasekara, et al, Failure Mechanisms in Semiconductor Devices, John Wiley & Sons, New York, 1987.
3. Doyle, et al, "How parts fail," IEEE Spectrum, October 1981.
4. Pollino, E, Microelectronic Reliability, Volume II, Artech House, Norwood, MA,1981.
5. Boxleitner, Warren, Electrostatic Discharge and Electronic Equipment, IEEE Press, New York 1989.
6. Lakshminarayanan, V, "Revisiting environmental stress screening," Evaluation Engineering, December 1999, pgs 72 to 78.
7. Lakshminarayanan, V, "What causes semiconductor devices to fail?" Test & Measurement World, November 1999, pgs 49 to 55.
8. Lakshminarayanan, V, "Basic steps to successful EMC design," RF Design, September 1999, pgs 35 to 47.
9. Lakshminarayanan, V, "Minimize ESD-induced failures," Advanced Packaging, August 1999, pgs 36 to 39.
10. Bipolar Power Transistor Databook, Motorola Inc, 1995.
11. MIL-HDBK-217F: Reliability Prediction for Electronic Equipment.
12. MIL-STD-883E: Test Method Standard for Microcircuits.