Electroless Plating Improving the Bending Strength of Copper Graphite Material

Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering

Volumn 27, Issue 3, 1998, Pages 185-

  Li, Yawen ^a   Ding, Huadong ^a   Hao, Hongqi ^a   Jin, Zhihao ^a  

^a XI'AN JIAOTONG UNIVERSITY   (China)

Author keywords

Bending strength; Copper graphite material; Electroless plating

Indexed keywords

EID: 0347175061     PISSN: 1002185X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (5)

1. Ding Huadong, Hao Hongqi, Jin Zhihao Influence of Graphite Content on Expansion of Copper Base Slider. Zhongguo Youse Jinshu Xuebao 1996;6(3):106
2. Keil A, Merl W A, Vinaricky E. Elektrische Kontakte und ihre Werkstoffe. New York: Spinger-Verlag. 1984:250
3. Fang Qixian. Surface Technology. Xi'an: Xi'an Jiaotong University Publishing House, 1992: 71
4. Huang Peiyun. Powder Metallurgy Principles Beijing: Metallurgicial Industry Publishing House, 1982:341
5. Ding Huadong, Li Yawen, Hao Hongqi et al. Grey Equation between Bending Strength and Porosity of Copper Graphite Material. Zhongguo Youse Jinshu Xuebao, 1996;6(4):123