Spatial variation of void morphology in resin transfer molded E-glass/epoxy composites

Journal of Materials Science Letters

Volumn 22, Issue 24, 2003, Pages 1813-1816

  Hamidi, Y K ^a   Altan, M C ^a  

^a University of Oklahoma   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SOFTWARE; CURING; EPOXY RESINS; GLASS; IMPREGNATION; KINEMATICS; MORPHOLOGY; NUMERICAL METHODS; PRESSURE DROP; RESIN TRANSFER MOLDING; THICKNESS MEASUREMENT; VOLUME FRACTION;

E-GLASS; MOLD FILLING; VOID MORPHOLOGY;

COMPOSITE MATERIALS;

EID: 0346503049     PISSN: 02618028     EISSN: None     Source Type: Journal    
DOI: 10.1023/B:JMSL.0000005428.88229.5b     Document Type: Article

References (7)

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4. N. C. Judd and W. W. Wright, SAMPE J. 14(1) (1978) 10.
5. B. D. Harper, G. H. Staab and R. S. Chen, J. Compos. Mater. 21 (1987) 280.
6. A. A. Goodwin, C. A. Howe and R. J. Paton, in Proceedings of ICMM-11, edited by M. L. Scott, Vol. IV, Australia, July 1997, p.11.
7. C. A. Howe, R. J. Paton and A. A. Goodwin, in Proceedings of ICCM-11, edited by M. L. Scott, Vol. IV, Australia, July 1997, p. 49.