Characterization of strain rate-dependent shear response of 63Sn/37Pb solder under uniaxial torsion

Key Engineering Materials

Volumn , Issue 180 PART 1, 2000, Pages 267-272

  Dai, L H ^a,b   Lee, S W R ^a   Huang, X J ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

^b INSTITUTE OF GEOLOGY AND GEOPHYSICS   (China)

Author keywords

Electronic Packaging; Shear Strength; Sn Pb Solder; Strain Rate Effect; Torsion

Indexed keywords

EID: 0346485648     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: None     Document Type: Article

References (6)

1. J.S. Hwang, Modem Solder Technology for competitive Electronics Manufacturing, McGraw-Hill, New York, NY, (1996).
2. J.H. Lau and Y.H. Pao, Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies, McGraw-Hill, New York, NY, (1997).
3. K.R. Stone, R.Duckett, S. Muckett and M. Warwick, Brazing and Soldering, 4 (1983) 20-27.
4. Y.-H. Pao et al., Journal of Electronic Packaging, 114 (1992) 135-144.
5. M.S. Liang, Studies on Constitutive Relation of Sn/Pb Alloy at High Strain Rate, MSc. Thesis, National Twain University, Taipei, Taiwan, (1996).
6. X.Q. Shi, W. Zhou, H.L.J. Pang and Z.P. Wang, Journal of Electronic Packaging, ASME Transactions, 121 (1999) 179-185.