Object-oriented cae system for structural design of LSI packages

American Society of Mechanical Engineers, EEP

Volumn 26 3, Issue , 1999, Pages 1027-1032

  Kojima, Kiyomi ^a   Terasaki, Takeshi ^a   Miura, Hideo ^a   Nishimura, Asao ^a  

^a HITACHI LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0346402614     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (9)

1. Chiba, N., Nishigaki, I., Yamashita, Y., Takizawa, C., and Fujishiro, K., 1998, "A Flexible Automatic Hexahedral Mesh Generation by Boundary-fit Method," Computer methods in applied mechanics and engineering, Elsever, New YorK, pp. 146-154.
2. Katayama, K., 1986, JSME Data Book, Heat Transfer, 4th Edition. JSME, pp. 44-46.
3. Kitano, M., Nishimura, A., and Kawai, S., 1992, "A New Evaluation Method for Thermal Fatigue Strength of Solder Joint, Proceedings of the 1992 Joint ASME/JSME Conference or Electronic Packaging, pp. 301-306.
4. Kitano, M., Nishimura, A., and Kawai, S., 1988, "Analysis of Package Cracking during Reflow Soldering Process," Proceedings of 26th International Reliability Physics Symposium, pp. 90-93.
5. Kitano, M., Yoneda, N., and Kawai, S., 1991, "A simple Analysis Method of Thermal Resistance of Plastic Packages," Transactions of the Japan Society of Mechanical Engineers, Vol. 57, No. 537, pp. 1846-1851.
6. Nishimura, A., Tatemichi, A., Miura, H., and Sakamoto, T., 1987, "Life Estimation for IC Plastic Packages under Temperature Cycling Based on Fracture Mechanics," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. CHMT-10, No. 4, pp. 637-642.
7. Nishimura, A., Hirose, I., and Tanaka, N., 1992, "A New Method for Measuring Adhesion Strength of IC Molding Compounds", Transactions of ASME, Journal of Electronic Packaging, Vol. 114, No. 4, pp. 407-412.
8. Peak, R. S. and Fulton, R. E., 1993, "Automating Routine Analysis in Electronic Packaging using Product Model-based Analytical Models (PBAMS): Part 1 - PBAM Overview," Proceeding of 1993 Annual Winter Meeting of ASME, Vol. 93-AW/EEP-23.
9. Sasaki, K., Saito, N., Amagi, S., and Haraguchi, Y, 1998, "Numerical Analysis of Residual Stress in Resin-Molded Products," Transactions of the Japan Society of Mechanical Engineers, Vol. 64, No. 622, pp. 1660-1666.