The inhibition of intermetaillics growth on the Cu-Sn border

Jinshu Xuebao/Acta Metallurgica Sinica

Volumn 38, Issue 7, 2002, Pages 727-730

  Ren, Feng ^a   Gao, Su ^a   Zhang, Qiyun ^a  

^a PEKING UNIVERSITY   (China)

Author keywords

Diffusion barriers soldering; Intermetallics; Lead wire of electronic components

Indexed keywords

EID: 0346384132     PISSN: 04121961     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (7)

1. Gao S, Zhang Q Y. Acta Phys Chem Sin, 2002; 18(3): 223
2. Tompkins H G, Pinnel M R. J Appl Phys, 1997; 48: 3144
3. Chang C A. J Appl Phys, 1986; 60: 1220
4. Kay P J, Mackay C A. Trans Inst Met Finishing, 1979; 57: 169
5. Ren F. Master Thesis, Beijing University, 1990
6. Lao B S, Gao S, Zhang Q Y. Acta Phys Chem Sin, 2001; 17(5): 453
7. Zhang Y Q, Han W S, Liu J K. Acta Metall Sin, 1989; 25: B369