X-ray profile analysis on dislocations and hardness of Copper films

Vacuum

Volumn 51, Issue 3, 1998, Pages 381-383

  Shan, F L ^a   Wang, Y M ^a  

^a JILIN UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0346309936     PISSN: 0042207X     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0042-207x(98)00118-3     Document Type: Article

References (9)

1. Wagendristed, A., Bangert, H., Cai, X. and Kaminutschek, A., Thin Solid Films, 1984, 114, 257.
2. Zhang, N. and Wang, Y., Thin Solid Films, 1992, 214, 4.
3. Stokes, A. R., Proc. Phys. Soc. London, 1948, 61, 382.
4. Warren, B.E., Progress in Metal Physics, Vol. 8. Pergamon Press, London, 1959, p. 147.
5. Wang, Y., Lee, S. and Lee, Y., J. Appl. Cryst., 1982, 15, 35.
6. Wang, Y. and Zhang, Z., Appl. Phys., 1987, A35, 109.
7. Wilkens, M., Phys. Status Solidi A, 1970, 2, 359
8. Li, Q., Materials Strength. Shanxi Science Education Press, Tai Yuan, 1990, p. 42.
9. Tazaki, M., Nishibori, M. and Kinosita, K., Thin Solid Films, 1978, 51, 13.