Passive cooling limits for unventilated notebook computers

Advances in Electronic Packaging

Volumn 1, Issue , 2001, Pages 553-560

  Solbrekken, Gary L ^a   Yazawa, Kazuaki ^a,b   Coxe, K C ^a   Bar Cohen, Avram ^a  

^a University of Minnesota   (United States)

^b SONY CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

RAYLEIGH NUMBERS; SURFACE EMISSIONS;

COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; COOLING; ELECTRONICS PACKAGING; HEAT FLUX; HEAT LOSSES; HEAT RADIATION; HEAT RESISTANCE; NATURAL CONVECTION; NUSSELT NUMBER; PRANDTL NUMBER; THERMAL CONDUCTIVITY OF SOLIDS; THERMAL DIFFUSION; VENTILATION;

LAPTOP COMPUTERS;

EID: 0346308475     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

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