Vibration-induced droplet atomization heat transfer cell for cooling of microelectronic components

Advances in Electronic Packaging

Volumn 2, Issue , 2001, Pages 779-784

  Heffington, Samuel N ^a   Black, William Z ^a   Glezer, Ari ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Microelectronics cooling; Spray cooling; Two phase heat transfer

Indexed keywords

SPRAY COOLING; VIBRATION INDUCED DROPLET ATOMIZATION (VIDA); WICK STRUCTURES;

ACTUATORS; ATOMIZATION; CAVITATION; COOLING; ELECTRONICS PACKAGING; EVAPORATORS; FINS (HEAT EXCHANGE); HEAT FLUX; HEAT PIPES; HEAT TRANSFER; HIGH TEMPERATURE EFFECTS; MICROPROCESSOR CHIPS; THERMAL STRESS; THERMOCOUPLES; THIN FILMS;

MICROELECTRONICS;

EID: 0346308390     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. SIA Semiconductor Industry Association, The National Technology Roadmap for Semiconductor, 1994.
2. Georgia Institute of Technology, Packaging Research Center, Third Annual Review, Atlanta Georgia, pp. 4.1-4.5, December 1997.
3. Peterson, G. P. An Introduction to Heat Pipes, John Wiley & Sons, Inc., New York, pp. 285-326, 1994.
4. Kiewra, E. W., and P. C. Wayner, "A Small Scale Thermosyphon for Immersion Cooling of a Disc Heat Source," Heat Transfer in Electronic Equipment, ASME Symposium HTD-Vol. 57, Bar-Cohen, A. (Ed.), American Society of Mechanical Engineers, New York, pp.77-82, 1986.
5. Mudawar, I., T. A. Incropera, and F. P. Incropera, "Microelectronic Cooling by Fluorocarbon Liquid Films," Proc. Int. Symposium of Cooling Technology for Electronic Equipment, 1987.
6. Smith, M. K., A. James, B. Vukasinovic, and A. Glezer, 1998, "Vibration-Induced Droplet Atomization," submitted for publication.
7. Denney, D. L., W. Z. Black, J. G. Hartley, and A. Glezer, "High Heat Flux Boiling with Monodisperse Water Droplets," Process. Enhanced, and Multiphase Heat Transfer, R. M. Manglik and A. D. Krause, eds., Begel House, Inc., New York, pp. 175-182, 1996.