Effect of milling on the damping behavior of nano-structured copper

Materials Science and Engineering: A

Volumn 366, Issue 1, 2004, Pages 38-44

  Srikanth, Narasimalu ^a   Thein, Maung Aye ^a   Gupta, Manoj ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

Anelasticity; Grain boundary; Interface; Nano material; Non destructive testing

Indexed keywords

COPPER; CRYSTALS; GRAIN SIZE AND SHAPE; NANOSTRUCTURED MATERIALS;

MECHANICAL MILLING (MM);

MATERIALS SCIENCE;

COPPER; DAMPING; ELASTICITY; EXTRUSION; GRAIN BOUNDARY; INTERFACE; MILLING;

EID: 0346216052     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2003.08.064     Document Type: Article

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