Electrical and rheological properties of colloidal alumina suspensions

Journal of Ceramic Processing Research

Volumn 1, Issue 1, 2000, Pages 64-68

  Wang, Xu Hong ^a   Hirata, Yoshihiro ^a  

^a KAGOSHIMA UNIVERSITY   (Japan)

Author keywords

Alumina suspension; Chemical bonding; Electrophoretic mobility; Green compact; Rheology; Valence; Viscosity

Indexed keywords

EID: 0346108407     PISSN: 12299162     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (7)

1. J.S. Reed, in "Introduction to the Principles of Ceramic Processing" (John Wiley & Sons, Inc., New York, 1988) p. 132.
2. Y. Hirata, I. Haraguchi, and Y. Ishihara, J. Mater. Res. 7[9] (1992) 2572-2578.
3. C. Ballario, A. Bonincontro, and C. Cametti, J. Colloid Interface Sci. 72[2] (1979) 304-313.
4. Y. Hirata and H. Wakita, J. Ceram. Soc. Jpn. 107 [4] (1999) 303-307.
5. L. Bergström, in "Surface and Colloid Chemistry in Advanced Ceramics Processing", Edited by R. J. Pugh and L. Bergström (Marcel Dekker, Inc., New York, 1994) p. 82.
6. S. Sameshima, Y. Arimura, and Y. Hirata, J. Ceram. Soc. Jpn. 104[4] (1996) 268-272.
7. Y. Hirata, S. Nakagama, and Y. Ishihara, J. Ceram. Soc. Jpn. 98[4] (1990) 316-321.