Electrical properties of Ti/TiN films prepared by chemical vapor deposition and their applications in submicron structures as contact and barrier materials

Thin Solid Films

Volumn 308-309, Issue 1-4, 1997, Pages 589-593

  Hu, J ^a   Ameen, M ^a   Leusink, G ^a   Webb, D ^a   Hillman, J T ^a  

^a Materials Research Corporation   (United States)

Author keywords

Barrier; Chemical vapor deposition; Titanium; Titanium nitride

Indexed keywords

CHEMICAL VAPOR DEPOSITION; ELECTRIC CONDUCTIVITY OF SOLIDS; ELECTRIC RESISTANCE; FILM PREPARATION; PLASMA APPLICATIONS; TITANIUM; TITANIUM NITRIDE;

PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION (PECVD);

METALLIC FILMS;

EID: 0346045978     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(97)00477-X     Document Type: Article

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